X-Ray Inspection

Our X-ray inspecting service is developed following the latest research results in electronics fabrication. We have created a service, which answers to the requirements of the reliability of the soldering processes.

When you add BGA- or Flip Chip components, which solder joints are not visual for eye, the only solution to be sure about their quality is the X-ray inspection. During the soldering process with all the other related processes there are many sources of defects.

Most Common Mistakes

Here you can see pictures from the most common solder defects.

Bridging/Short

Most commonly the problem is in solder balls which are soldered together or almost together. These solder balls may hide behind the capacitors of the bottom side or behind other opaque object when we are looking the picture from above. With our machinery we can examine the objects from different angles without changing or decreasing the magnification.

Open

Missing soldering mass can be inspected by the eye but when the pin pitch becomes smaller the picture handling skills become more important. In worst case the open can be only a thin fracture and to find this fracture it's necessary to use the least clues about the changes in solder's density. Due to our machinery's good resolution capability we see even tiniest fractures.

Voids

There are many research results with their recommendations from all around the world about voids inside the solders. Voids really have an effect on the endurance of the solder joints. We can see all the variations of voids in the solder joints.

We offer X-ray inspection services including failure reports and statistics, which provide you with the necessary details to improve your process.

We constantly develop and train our staff and our customers, to keep up in competitiveness in the challenging world of electronic production.

		X-ray inspection Elmar Bernhardt Test- and electronics design manager Mobile. +358 50 370 7671 Fax. +358 15-525 0257 firstname.surname@3ktehdas.com
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